TJ-29US-V5 Stencil cleaning machine
锡膏清洗周期小于15 分钟，胶水清洗周期小于35 分钟。
Patent design, close contacting ultrasonic combining with spray cleaning, the stencil is no need to dip
into the tank.
The stencil moves up and down with a gap 0.5-2mm between the ultrasonic source with the cleaning
agent flows by.
High pressure air knives blowing the stencil closely during the lift makes the drying time very short.
Efficiently clean fine printing pitch and apertures with the solder paste and glue.
The cycle time is less than 15 min for the solder paste and 35 min for the glue.